Jingye Future Intelligent Manufacturing (Shenzhen) Technology Co., Ltd., a subsidiary of Chinese steel giant Jingye Group, has signed an agreement with the Fengshun County People's Government to build a manufacturing base in Fengshun County, Meizhou City, Guangdong Province, with an investment of RMB 5 billion (approximately USD 700 million). The base will be equipped with 400 metal 3D printers, 20 metal powder production lines, and 100 MIM (metal injection molding) production lines. At full capacity, it is expected to generate an annual output value of RMB 10 billion and create over 1,000 jobs. Construction has already begun, with partial production planned before the end of 2026. The base focuses on precision components for 3C consumer electronics, starting with foldable screen hinges and camera modules; the powder lines will supply both additive manufacturing and MIM, aiming to establish a high-performance metal powder R&D and production base in South China. Phase I investment is approximately RMB 2 billion, and Phase II approximately RMB 3 billion. Local officials call it the largest single industrial investment Fengshun has attracted in recent years. Deputy County Mayor Zeng Xiaoli and Han Xiaofeng, head of Jingye Future Intelligent Manufacturing, attended the signing ceremony. Regarding the competitive landscape, foldable screens have become the main battleground: OPPO Find N5 uses a titanium alloy hinge printed by BLT (Bright Laser Technologies), and Apple's foldable iPhone suppliers are reportedly also adopting 3D-printed hinge modules. According to CONTEXT analysis, growth in China's metal powder bed fusion (PBF) market is being driven by rising consumer electronics volume, with domestic equipment dominating. Value for powder buyers: ① The base includes 20 metal powder production lines; demand for titanium alloys, aluminum alloys, stainless steel, and MIM feedstock will surge with mass production of hinges and camera modules, changing the powder supply landscape in South China; ② Batch stability and cost of fine powders (15-53μm) for consumer electronics are key to competition. Powder manufacturers can focus on supporting opportunities for 3C customers in South China and the MIM feedstock market.