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Dou Yee Technologies Partners with HP and NAMIC to Advance Metal Binder Jetting: 316L and 17-4PH Certified

2026-09-24 · Impact score: 60

On September 24, 2026, Singapore-based Dou Yee Technologies (DYT) announced progress in building its metal binder jetting (BJT) capabilities. The company is collaborating with HP and Singapore's National Additive Manufacturing Innovation Cluster (NAMIC), building on a memorandum of understanding signed at the October 2025 Global Additive Manufacturing Summit, and jointly with A*STAR's Additive Innovation Centre (AIC) to advance industrial application development of HP Metal Jet technology. Founded in 1996, DYT is a leading Southeast Asian manufacturer of metal injection molding (MIM) and ceramic injection molding (CIM) components, and also provides services such as metal laser powder bed fusion (PBF-LB). The BJT project extends its powder metallurgy expertise into sintering-based metal additive manufacturing: 316L and 17-4PH stainless steels have completed in-project material certification, copper alloys are under evaluation, and nickel-based superalloys and WC-Co are included in subsequent development plans. Target industries are tooling, automotive, and medical. The project aims to establish a complete workflow from development to mass production, accelerate material and process certification, and conduct industry pilots. Alex Moñino, Senior Vice President of HP Additive Manufacturing Solutions, noted that Singapore is at the center of Southeast Asia's manufacturing ecosystem. Tan See Cheong, Vice President of DYT, pointed out that BJT is suitable for high-value-added complex parts with high-mix, low-volume production and mold-free rapid delivery. Value for powder buyers: ① Demand for fine-particle stainless steel powders (316L/17-4PH) for the BJT process will grow as capacity ramps up, adding a new sintering-based powder consumption channel in Southeast Asia; ② If the copper alloy powder evaluation passes, it will open a new regional market for pure copper/copper alloy BJT powders; ③ By monitoring the pace of subsequent nickel-based and WC-Co material certifications, buyers can engage early with qualification and specification requirements.

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Dou Yee Technologies携手HP和NAMIC推进金属粘结剂喷射：316L与17-4PH完成认证

2026年9月24日，总部位于新加坡的Dou Yee Technologies（DYT）披露其金属粘结剂喷射（BJT）能力建设进展：公司与HP及新加坡国家增材制造创新集群NAMIC合作，基于2025年10月全球增材制造峰会签署的谅解备忘录，联合A*STAR增材创新中心（AIC）推进HP Metal Jet技术的工业应用开发。 DYT成立于1996年，是东南亚领先的金属注射成形（MIM）与陶瓷注射成形（CIM）部件制造商，同时提供金属激光粉末床熔融（PBF-LB）等服务。BJT项目将其粉末冶金专长延伸至烧结类金属增材制造：316L与17-4PH不锈钢已完成项目内材料认证，铜合金正在评估中，镍基高温合金与WC-Co列入后续开发计划，目标行业为工装、汽车与医疗。项目旨在建立从开发到量产的完整工作流，加速材料与工艺认证，并开展行业试点。HP增材制造解决方案高级副总裁Alex Moñino称新加坡处于东南亚制造生态中心，DYT副总裁Tan See Cheong指出BJT适合多品种小批量、免模具快速交付的高附加值复杂零件。对粉末采购商的价值：① BJT工艺对细粒径不锈钢粉（316L/17-4PH）的需求将随产能爬坡增长，东南亚新增一条烧结类粉末消耗通道；② 铜合金粉评估若通过，将为纯铜/铜合金BJT粉打开新的区域市场；③ 关注其后续镍基与WC-Co材料认证节奏，可提前接触资质与规格要求。

🧪 Related Material Grades

Metal powder grades mentioned in this article — specs, live prices & verified suppliers

316L Stainless Steel Powder

15-45 µm / 15-53 µm

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17-4PH Stainless Steel Powder

15-45 µm / 15-53 µm

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Pure Copper Powder

15-53 µm / 20-63 µm

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304L Stainless Steel Powder

15-53 µm

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CuCrZr Copper Alloy Powder

15-53 µm

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CuCrNb (GRCop) Copper Alloy Powder

15-53 µm

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