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3D Printed Electronics Company APES Joins Great Lakes Semiconductor's First Innovation Incubation Program

2026-09-23 · Impact score: 60

3D printed electronics specialist APES has joined Great Lakes Semiconductor's (GLS) first Innovation Funnel program, aiming to accelerate advanced semiconductor packaging from lab prototypes to the commercial market and overcome the industry's 'valley of death'. The first project targets automotive AI sensors, with seven organizations participating: GLS, APES, Japan's Daikin, NEITAS, BlueDot Ventures, FMC, and AltaScient. GLS and FMC chips will be packaged on APES-printed substrates, integrated with BlueDot sensors. APES's Matrix6D platform uses a magnetic levitation conveyor build platform and multiple toolheads (polymer deposition, circuit printing, milling) to support software-defined, high-mix, low-volume electronics manufacturing, driving the evolution of 2.5D/3D chiplet SiP packaging. Value for powder buyers: 3D printed electronic substrates primarily use polymers/conductive pastes, so metal powders do not directly benefit yet. If advanced packaging extends to metal interconnects and thermal structures, it could open new incremental demand for fine copper and silver powders, making the expansion of Matrix6D's material system worth tracking.

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3D打印电子企业APES加入大湖半导体首个创新孵化项目

3D 打印电子专家 APES 加入 Great Lakes Semiconductor（GLS）首个 Innovation Funnel 项目，目标是把先进半导体封装从实验室原型加速推向商业市场，破解行业「死亡之谷」难题。首个项目面向汽车 AI 传感器，7 家单位共同参与：GLS、APES、日本大金（Daikin）、NEITAS、BlueDot Ventures、FMC 与 AltaScient；GLS 与 FMC 芯片将封装于 APES 打印基板，搭配 BlueDot 传感器集成。APES 的 Matrix6D 平台采用磁悬浮输送构建平台与多工具头（聚合物沉积、电路打印、铣削），支持软件定义的高混小批量电子制造，推动 2.5D/3D 芯粒 SiP 封装演进。对粉末采购商的价值：3D 打印电子基板以聚合物/导电浆料为主，金属粉末暂不直接受益；若先进封装延伸至金属互连与散热结构，将为微细铜粉、银粉打开新增量，值得跟踪 Matrix6D 材料体系扩张。

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