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Youyan Heavy Metallurgy Obtains Patent CN118218607B for Nano Copper-Coated Metal Composite Powder Preparation: Core-Shell Structure Achieves Scale-Up, Highly Active Nano Copper Powder Passes Top-Tier Validation
2026-09-18
Youyan Heavy Metallurgy (a wholly-owned subsidiary of Youyan Powder Materials, stock code 688456) has been granted an invention patent for "Preparation Method and Apparatus for Nano Copper-Coated Metal Composite Powder," with publication number CN118218607B and authorization date September 18, 2026. Technical highlights: The patent provides a low-cost, controllable method for preparing core-shell structured nano copper-coated metal composite powders. It inhibits oxidation and agglomeration of nano copper, improves dispersibility and sintering activity, and enables large-scale production, directly addressing industrialization pain points such as easy oxidation, storage difficulties, and high costs of nano copper powder. Industry background: Highly active nano copper powder has passed validation by leading electronic paste companies and is being supplied in small batches, targeting applications in PCB copper paste, power chip packaging, and photovoltaic conductive paste. The patent authorization further consolidates Youyan's position in domestic substitution of nano metal powders.
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有研重冶取得纳米铜包覆金属复合粉体制备专利CN118218607B：核壳结构规模化，高活性纳米铜粉已过头部验证
有研重冶（有研粉材 688456 全资子公司）取得「纳米铜包覆金属复合粉体的制备方法及其制备装置」发明专利授权，公告号 CN118218607B，授权公告日 2026-09-18。技术要点：提供低成本、可控的核壳结构纳米铜包覆金属复合粉体制备方法，可抑制纳米铜的氧化与团聚、改善分散性与烧结活性，实现规模化生产，直击纳米铜粉易氧化、难储存、成本高的产业化痛点。产业背景：高活性纳米铜粉已通过电子浆料头部企业验证并小批量供货，应用指向 PCB 铜浆、功率芯片封装、光伏导电浆料等场景；该专利授权进一步巩固有研系在纳米金属粉体的国产替代卡位。