On August 26, 2026, the 2026 Formnext Asia Shenzhen International Exhibition for 3D Printing, Additive Manufacturing, and Precision Molding kicked off at Hall 15 of the Shenzhen World Exhibition & Convention Center (running through August 28), featuring over 350 exhibitors and an expected 30,000 professional visitors. New this year are a dedicated copper-based printing zone for AI heat dissipation/liquid-cooling microchannels and a thermal management forum. On opening day, green-laser copper printing took center stage: Hans Laser (Dazu Juwei) debuted the HANS M420G green-laser metal printer (532nm wavelength boosts pure copper absorption to ~40% with a 40μm spot size); Xihe Additive showcased a green-laser equipment lineup with build sizes up to 1.2 meters; Nanfang Additive exhibited a 150μm micro-channel pure copper heat sink (40%+ improvement in heat exchange efficiency); and Farsoon Technologies displayed a copper alloy cold plate achieving 0.03mm precision and 99.99% density. On the powder front: Zhongti XinCai unveiled CNPC-Cu high-purity copper powder (purity ≥99.95%, suitable for 3.2T high-speed optical modules and liquid-cooled housings for supercomputing) alongside CuCrZr and CuCrNb aerospace-grade copper alloys; Wilary showcased GH3625/GH4169/GH4099 superalloy powders and TC4 titanium powder; and AMC Powders presented over 200 metal powders across nine alloy families. Value for powder buyers: ① AI liquid cooling and high-speed optical modules are the fastest-growing application for pure copper powder, with high-purity copper (≥99.95%) demand directly benefiting; ② Maturation of green-laser technology is moving pure copper and copper alloy printing from aerospace to data-center liquid cooling at scale, opening procurement windows for precipitation-hardened alloys like CuCrZr; ③ The equipment-powder matrix at the show reflects the 'copper replacing aluminum' upgrade trend in thermal materials, prompting powder suppliers to stock low-oxygen copper and copper alloy grades.