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Polish Microprinting Company XTPL Enters Japanese Market for the First Time, Delivers UPD Modules for Advanced PCBs and Packaging

2026-06-18

Polish microprinting company XTPL has announced its first entry into the Japanese market, delivering an ultra-precision dispensing (UPD) module to an undisclosed Japanese listed company, with delivery scheduled for Q4 2026. The Japanese client, described as a "publicly listed advanced automation industrial equipment manufacturer," will integrate the UPD module into a prototype under development to test its industrialization potential for advanced printed circuit board and semiconductor packaging applications. This sale marks XTPL's first use of copper-based materials—the most important material category in the advanced packaging market—following previous sales in Taiwan, China (for flat panel display production) and Silicon Valley.

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波兰微打印公司XTPL首次进入日本市场，交付UPD模块用于先进PCB和封装

波兰微打印公司XTPL宣布首次进入日本市场，向一家未公开名称的日本上市公司交付超精密点胶（UPD）模块，计划2026年第四季度交付。该日本客户是一家“公开上市的先进自动化工业设备制造商”，将把UPD模块安装于正在开发的原型机中，用于测试其在先进印刷电路板和半导体封装应用中的工业化潜力。此次销售是XTPL首次采用铜基材料——先进封装市场最重要的材料类别，此前XTPL已在中国台湾（平板显示器生产）和硅谷完成销售。

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