A team from the Karlsruhe Institute of Technology (KIT) has developed the 'Metal-Coated Freeform Structures' (MCFS) process, combining direct-write multiphoton lithography with targeted metal deposition. First, polymer support structures with nearly freely selectable geometries are 3D-printed via multiphoton lithography, then selectively metallized in defined areas using precisely oriented shadow masks. The resulting surfaces exhibit high quality, with electrical conductivity close to the solid material values of the respective metals, requiring no manual assembly steps. The team demonstrated broadband chip-to-chip interconnects, terahertz measurement tips, and on-chip standalone antennas up to 0.3 THz. This process is particularly suited for manufacturing terahertz components in small batches, with complex geometries and short development cycles, combining additive manufacturing with the metal properties needed for high frequencies, thereby expanding the manufacturing capabilities of chip-level terahertz systems.