Domestic Expansion Neutral

Siri Advanced Materials Plans 919M Yuan Investment in Electrothermal Functional Materials Project, Expanding Production for Optical Module Chip Substrates and High-Voltage Switches

2026-06-20 · Impact score: 37

Siri Advanced Materials (688102) announced plans to invest in the "Electrothermal Functional Materials R&D and Manufacturing Base Construction Project," with a total investment of 919 million yuan and a construction period of 5 years, expected to be operational by December 2030. The project comprises two sub-projects: a 4000-million-unit optical module chip substrate and housing materials project (planned investment of 479 million yuan), which upon completion will achieve an annual capacity of 25 million optical module chip substrate materials and 15 million optical module housing materials; and a 1,290-ton high-voltage switch contact and component project (planned investment of 440 million yuan), including 1,020 tons of copper-chromium (CuCr) products and 270 tons of tungsten-copper (WCu) products. Tungsten-copper materials are the mainstream solution for optical module chip substrate heat sinks, and the company is actively developing next-generation heat sink materials such as molybdenum-copper (MoCu) and copper-diamond (Cu-Diamond). This project will further expand the application demand for alloy powders like WCu and CuCr in optical module thermal management and power equipment sectors.

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斯瑞新材拟投9.19亿元建设电热功能材料项目，光模块芯片基座+高压开关双线扩产

斯瑞新材（688102）公告拟投资建设“电热功能材料研发制造基地建设项目”，总投资9.19亿元，建设期5年，预计2030年12月达到可使用状态。项目包括两大子项目：4000万件光模块芯片基座及壳体材料项目（拟投资4.79亿元），建成后将实现年产2500万件光模块芯片基座材料、1500万件光模块壳体材料的产能；1290吨高压开关触头及零组件项目（拟投资4.40亿元），包含铜铬产品1020吨、钨铜产品270吨。钨铜材料是光模块芯片基座热沉的主流应用方案，公司正积极开发钼铜、铜金刚石等下一代热沉材料。该项目将进一步扩大钨铜、铜铬等合金粉末在光模块散热和电力装备领域的应用需求。

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