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Formnext Asia Shenzhen to Open in August, Spotlighting AI Liquid Cooling and Thermal Management

2026-05-11

The 2026 Formnext Asia Shenzhen exhibition is scheduled for August 26–28 at the Shenzhen World Exhibition & Convention Center, with one of its core themes being additive manufacturing thermal management solutions for AI infrastructure. Addressing the heat dissipation challenges posed by high-density AI server chips, additive manufacturing is drawing attention for its advantages in designing complex internal channels. The event will showcase a complete liquid cooling additive manufacturing supply chain, from metal powders and printing equipment to mass production services. Leading industry players will present laser powder bed fusion (L-PBF) systems and materials for processing pure copper and copper alloys. Concurrent professional forums will delve into application cases of 3D-printed parts in AI server environments, offering new technical approaches to tackle cooling challenges from the surge in AI computing power.

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Formnext Asia深圳展8月开幕，聚焦AI液冷与热管理

2026年Formnext Asia深圳展定于8月26日至28日在深圳国际会展中心举行，本届展会核心议题之一为面向AI基础设施的增材制造热管理解决方案。面对高密度AI服务器芯片带来的散热挑战，增材制造因其在设计复杂内部流道方面的优势而备受关注。展会现场将集中展示从金属粉末、打印设备到批量生产服务的完整液冷部件增材制造产业链。业界知名企业将展示用于加工纯铜及铜合金的激光粉末床熔融(L-PBF)系统及相关材料。此外，同期举办的专业论坛将深入探讨3D打印部件在AI服务器环境中的应用案例，为应对AI算力爆发带来的散热挑战提供了新的技术思路。

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America Makes Announces 2026 Ambassadors and Outstanding Collaboration Award

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