The Fraunhofer Institute for Photonic Microsystems (IPMS) in Germany is testing a dense chipset integration technology for compact 3D printing systems. This research aims to significantly improve the integration level, reduce the size, and optimize the performance of control systems in 3D printing equipment through high-density integration of electronic chipsets. Traditional 3D printer control systems typically consist of multiple distributed circuit boards and modules, whereas chip-level integration can consolidate core functions such as motion control, temperature management, and laser modulation into a smaller space. This is crucial for developing desktop-level industrial devices, portable printing systems, or highly integrated multi-laser, multi-material printing platforms. The technology is expected to reduce system complexity, enhance reliability, and provide core hardware support for the development of next-generation intelligent, compact additive manufacturing equipment.