On August 10, 2026, Asia Advanced Materials officially launched a Cu15Ni8Sn pre-alloyed powder produced via vacuum inert gas atomization (VIGA). SLM forming trials have demonstrated a tensile strength of ≥1000 MPa and a hardness of ≥34 HRC, with performance comparable to traditional beryllium copper yet entirely non-toxic and safe throughout the entire process. Leveraging the rapid melting and solidification characteristics of SLM, Sn segregation is suppressed to the micron level—a persistent challenge in conventional casting—while the powder's laser absorptivity exceeds 35%.
The alloy offers superior corrosion resistance (in seawater, acidic, and oil & gas environments) and wear resistance compared to beryllium copper. Its limitation lies in an electrical conductivity of only 9% IACS, making it unsuitable for high-conductivity applications. Target applications include aerospace landing gear bearings and elastic sealing rings, 5G connectors and chip test sockets, marine engineering equipment, and high-load bearings. The Cu-Ni-Sn system is widely recognized by academia as the most promising non-toxic copper alloy alternative to beryllium copper.
This breakthrough underscores the competitiveness of domestic metal powder producers in specialized alloy segments—not as a replacement for commodity powders like 316L or TC4, but as a first-mover advantage in the high-performance copper alloy arena, specifically in the beryllium copper substitution track. Asia Advanced Materials' SLM-ready powder pushes the material to the forefront of industrialization.
Value for powder buyers: (1) With aerospace and electronics industries trending away from beryllium copper due to its toxicity, Cu15Ni8Sn is the leading non-toxic substitute material; its SLM powder form opens up additive manufacturing applications. (2) Target applications such as aerospace landing gear bearings and elastic sealing rings demand extremely high fatigue performance, so subsequent fatigue test data should be closely monitored. (3) With electrical conductivity at only 9% IACS, beryllium copper remains necessary for scenarios requiring both high conductivity and high strength (e.g., resistance welding electrodes); evaluation should be based on specific application requirements.
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亚洲新材料Cu15Ni8Sn无铍铜合金粉末SLM成形:强度破1000MPa,对标铍铜
2026年8月10日,亚洲新材料正式推出采用真空气雾化(VIGA)技术制备的Cu15Ni8Sn预合金粉末。经SLM成形验证,抗拉强度≥1000MPa、硬度≥34HRC,性能对标传统铍铜但全流程无毒无害。利用SLM快熔快凝特性将Sn元素偏析抑制在微米级别(传统铸造工艺中Sn偏析是核心难题),粉末激光吸收率超35%。
耐腐蚀性(海水/酸性/油气环境)和耐磨性优于铍铜。局限是导电率仅9% IACS,不适合高导电场景。目标应用:航空航天起落架轴承/弹性密封环、5G连接器/芯片测试插座、海洋工程装备、高载荷轴承。Cu-Ni-Sn体系是学术界公认的最有希望替代铍铜的无毒铜合金体系。
这项突破体现了国产金属粉末企业在细分合金领域的竞争力——不是为了替代316L/TC4等大宗粉末,而是在高性能铜合金这一铍铜替代赛道上建立先发优势。亚洲新材料的SLM粉末化将其推向了产业化前沿。
对粉末采购商的价值:① 航空航天和电子行业面临铍铜因毒性被替代的趋势,Cu15Ni8Sn是首选无毒替代材料,SLM粉末化打开增材制造应用空间 ② 目标应用中航空航天起落架轴承和弹性密封环对材料疲劳性能要求极高,需关注后续疲劳测试数据 ③ 导电率仅9% IACS,在需要高导电+高强度的场景(如电阻焊电极)仍需铍铜,需根据实际应用场景评估。