As AI computing clusters face sharply rising power density and the commercial aerospace sector enters a high-growth cycle, thermal management has evolved from background support into a core bottleneck. To address this, Jinyuan Intelligent has developed copper alloy powders — CuCrZr and pure copper — specifically tailored for Laser Powder Bed Fusion (LPBF), offering high thermal and electrical conductivity. Through coordinated efforts across the entire process chain, including strict raw material quality control, precise alloy composition tuning, and forming process optimization, the thermal conductivity of pure copper printed parts is consistently maintained above 400 W/(m·K), while CuCrZr printed parts remain above 350 W/(m·K). Additive manufacturing of high-conductivity copper and copper alloys, leveraging their ability to form complex flow channels in one step and their excellent thermal and electrical properties, is becoming a key competitive field in thermal management.