As AI computing clusters face sharply rising power density and the commercial aerospace sector enters a high-growth cycle, thermal management has evolved from background support into a core bottleneck. To address this, Jinyuan Intelligent has developed copper alloy powders — CuCrZr and pure copper — specifically tailored for Laser Powder Bed Fusion (LPBF), offering high thermal and electrical conductivity. Through coordinated efforts across the entire process chain, including strict raw material quality control, precise alloy composition tuning, and forming process optimization, the thermal conductivity of pure copper printed parts is consistently maintained above 400 W/(m·K), while CuCrZr printed parts remain above 350 W/(m·K). Additive manufacturing of high-conductivity copper and copper alloys, leveraging their ability to form complex flow channels in one step and their excellent thermal and electrical properties, is becoming a key competitive field in thermal management.
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金源智能推出高导热纯铜及CuCrZr粉末,纯铜热导率超400W/(m·K)
随着AI算力集群功耗密度急剧攀升及商业航天进入高热度发展周期,热管理正从后台支撑跃升为核心瓶颈。金源智能为此专门开发了适配激光粉末床熔融工艺的铜合金粉末——CuCrZr及纯铜,兼具高导热、高导电特性。通过原材料品质严控、合金成分精调、成形工艺优化等全链条协同攻关,纯铜打印件热导率稳定保持在400 W/(m·K)以上,CuCrZr打印件热导率稳定保持在350 W/(m·K)以上。高导热铜及铜合金的增材制造凭借复杂流道一体化成型能力与优异的导热导电性能,正成为热管理领域的关键赛道。