In high-end manufacturing, material selection often involves trade-offs: extreme thermal conductivity sacrifices strength, while pursuing strength compromises conductivity or heat resistance. Leveraging the technical expertise of the School of Materials Science and Engineering at the University of Science and Technology Beijing, Asia New Material has broken the 'impossible triangle' with verified data: pure copper achieves thermal conductivity of 442 W/(m·K), CuCrZr delivers tensile strength of 586 MPa and electrical conductivity of 76% IACS, CuCrNb-42 via SLM+HIP consistently reaches 35.5% elongation with 68% reduction of area, and CuSn12Ni2 attains tensile strength of 692 MPa combined with wear resistance. From powder source to as-printed parts, these four copper-based solutions cover the full spectrum of thermal management, structural, high-temperature, and wear-resistant applications.