At the HUST Technology AI Full-Industry-Chain Advanced Manufacturing Ecosystem Conference, the 3DP Additive Manufacturing Division of HUST Laser revealed that as AI chip power consumption surges, liquid cooling has become a necessity for high-end computing centers. Metal 3D printing uses high-purity copper powder to directly form monolithic, high-thermal-conductivity heat sinks with complex microchannels, solving the manufacturing challenge of producing 0.1mm-scale ultra-fine channels as a single piece. This avoids the interfacial thermal resistance and leakage risks associated with traditional multi-part assembly, while drastically reducing product iteration cycles. HUST Technology's East China headquarters base in Suzhou is now fulfilling batch deliveries with a full production schedule, and a 50-mu (approx. 3.3-hectare) manufacturing base in Wuhan is under accelerated construction, expected to begin operations by 2027. The application of metal 3D printing in AI thermal management has moved from technical validation to volume production, signaling accelerating demand for high-purity copper powder in computing infrastructure.