At Huagong Tech’s AI Full-Chain Advanced Manufacturing Ecosystem Conference, Huagong Laser’s 3DP Additive Manufacturing Division revealed that as AI chip power consumption surges, liquid cooling has become a critical requirement for high-end computing centers. Metal 3D printing directly integrates high-purity copper powder into shaped microchannel high-thermal-conductivity cooling components, overcoming the manufacturing challenge of 0.1 mm-level ultrafine channels that cannot be formed in one piece via conventional methods. This eliminates interface thermal resistance and leakage risks associated with traditional multi-part assembly while significantly shortening product iteration cycles. Currently, Huagong Tech’s Suzhou Smart Manufacturing East China Headquarters Base has achieved batch delivery with full production schedules. A 50-mu Wuhan production base is under accelerated construction and is expected to become operational by 2027. The application of metal 3D printing in AI thermal management has moved from technical validation to batch delivery, marking the accelerating demand for high-purity copper powder in computing infrastructure.