October 24, Qizhidao patent monitoring reported: Jiangxi Copper (jointly applied by Jiangxi Copper Corporation Limited, Jiangxi Copper Technology Research Institute, and Nanchang R&D Center) published invention patent CN122938293A on October 20, titled "A High Infrared Laser Absorptivity Pure Copper SLM Printing Material and Printing Method" (application number 2026111379762, filing date 2026-07-29). Technical solution: a rational blend of nano Cr powder, nano Nb powder, and micron-sized spherical copper powder, combined with a dedicated SLM printing process and aging treatment, improves the infrared laser absorptivity of pure copper while ensuring the density, mechanical properties, and electrical conductivity of printed parts, enabling high-quality forming of complex-structure pure copper components. Pure copper has long been difficult to form stably using laser powder bed processes due to its high reflectivity (low absorptivity) to infrared lasers in the 1 μm band; this approach provides an industry-level solution for copper-based SLM material modification, aligning with the growing adoption of copper powder in additive manufacturing applications such as heat dissipation, electrical conductivity, and aerospace thrust chambers.